List of electronics package dimensions
Dimension reference
Surface-mount
|
C Clearance between IC body and PCB
H Total Height
T Lead Thickness
L Total Carrier Length
LW Lead Width
LL Lead Length
P Pitch
WB IC Body Width
WL Lead-to-Lead Width
|
Through hole
|
C Clearance between IC body and board
H Total Height
T Lead Thickness
L Total Carrier Length
LW Lead Width
LL Lead Length
P Pitch
WB IC Body Width
WL Lead-to-Lead Width
|
Package dimensions
All measurements below are given in mm. To convert mm to mil, divide mm by 0.0254 (ie 2.54 mm / 0.0254 = 100 mill).
C - Clearance between package body and PCB.
H - Height of package from pin tip to top of package.
T - Thickness of pin.
L - Length of package body only.
LW - Pin width.
LL - Pin length from package to pin tip.
P - Pin pitch (distance between conductors to the PCB).
WB - Width of the package body only.
WL - Length from pin tip to pin tip on the opposite side.
Dual row
| Image |
Family |
Pin |
Name |
Package |
WB |
WL |
H |
C |
L |
P |
LL |
T |
LW |
|
DIP |
Y |
Dual Inline Package |
8-DIP |
6.2-6.48 |
7.62 |
7.7 |
|
9.2-9.8 |
2.54 |
3.05-3.6 |
|
1.14-1.73 |
| 32-DIP |
|
15.24 |
|
|
|
2.54 |
|
|
|
|
LFCSP |
N |
Lead Frame Chip Scale Package |
|
|
|
|
|
|
0.5 |
|
|
|
|
MSOP |
Y |
Mini Small Outline Package |
8-MSOP |
3 |
4.9 |
1.1 |
0.15 |
3 |
0.65 |
|
0.23 |
0.38 |
|
SO
SOIC
SOP |
Y |
Small Outline Integrated Circuit |
8-SOIC |
3.9 |
5.8-6.2 |
1.72 |
0.10-0.25 |
4.8-5.0 |
1.27 |
1.05 |
0.19-0.25 |
0.39-0.46 |
| 14-SOIC |
3.9 |
5.8-6.2 |
1.72 |
0.10-0.25 |
8.55-8.75 |
1.27 |
1.05 |
0.19-0.25 |
0.39-0.46 |
| 16-SOIC |
3.9 |
5.8-6.2 |
1.72 |
0.10-0.25 |
9.9-10 |
1.27 |
1.05 |
0.19-0.25 |
0.39-0.46 |
| 16-SOIC |
7.5 |
10.00-10.65 |
2.65 |
0.10-0.30 |
10.1-10.5 |
1.27 |
1.4 |
0.23-0.32 |
0.38-0.40 |
|
SOT |
Y |
Small Outline Transistor |
SOT-23-8 |
1.6 |
2.8 |
1.45 |
|
2.9 |
0.65 |
0.6 |
|
0.22-0.38 |
|
SSOP |
Y |
Shrink Small-Outline Package |
|
|
|
|
|
|
|
|
|
|
|
TDFN |
? |
Thin Dual Flat No-lead |
8-TDFN |
3 |
3 |
0.7-0.8 |
|
3 |
0.65 |
N/A |
|
0.19-0.3 |
|
TSOP |
Y |
Thin Small-Outline Package |
|
|
|
|
|
|
|
|
|
|
|
TSSOP |
Y |
Thin Shrink Small Outline Package |
8-TSSOP |
4.4 |
6.4 |
1.2 |
0.15 |
3 |
0.65 |
|
0.09-0.2 |
0.19-0.3 |
|
µSOP |
Y |
Micro Small Outline Package |
|
|
|
|
|
|
0.5 |
|
|
|
Quad rows
| Image |
Family |
Pin |
Name |
Package |
WB |
WL |
H |
C |
L |
P |
LL |
T |
LW |
|
CLCC |
N |
Ceramic Leadless Chip Carrier |
48-CLCC |
14.22 |
14.22 |
2.21 |
|
14.22 |
1.016 |
N/A |
|
0.508 |
|
LQFP |
Y |
Low-profile Quad Flat Package |
|
|
|
|
|
|
|
|
|
|
|
TQFP |
Y |
Thin Quad Flat Pack |
TQFP-44 |
10.00 |
12.00 |
|
0.35-0.50 |
|
0.80 |
1.00 |
0.09-0.20 |
0.30-0.45 |
|
TQFN |
N |
Thin Quad Flat No-lead |
|
|
|
|
|
|
|
|
|
|
See also
External links
